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NovoLINC logo

NovoLINC

Materials & Chemicals

Recent Finacing

Seed

Recent Raise

Undisclosed


NovoLINC develops advanced thermal interface solutions using nanostructured materials to improve heat management in high-performance computing and semiconductor industries.

Total Funding

Undisclosed

Headquarters

Pittsburgh, USA

Founded

N/A

Focus Areas

Thermal technology
nanostructured materials
thermal management
high-performance computing
heat dissipation
AI data centers

Investors

Foothill Ventures logo
TDK Ventures logo
M Ventures logo